Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.

介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。

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Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.

介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。

youdao