这导致引线框架和检测元件 之间的具有改善的电连接状态。
This results that the lead frame and the detection element have improved electrical connection.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
Gold, silver and nickel plating of IC lead frame and package shell.
应用推荐