首先在基片上覆盖一个掩膜片。
所述封装包括有金属基片的芯片支座。
The package includes a chip carrier which has a metal substrate.
而国内基片生产几乎是空白。
研究了衬底材料、基片温度对膜微结构的影响。
The effect of substrate materials and its temperature on film micro structure is studied.
而且能量的影响在较低的基片温度或是较高的沉积速率时更加显著。
This effect is very significant at low substrate temperature or high deposition rate.
可根据客户要求，生产各种特殊规格及工艺的陶瓷导电基片、陶瓷PCB。
We can offer diversified special specifications and technical china electric basic board, china PCB.
此外对石墨导热体和置于其上的玻璃基片两者之间的温度差别做了初步研究。
The temperature difference between the thermal conductor and the glass substrate was also studied.
此外对石墨导热体和置于其上的玻璃基片两者之间的温度差别做了初步研究。
The temperature difference between the thermal conductor and the glass substrate was also studied.
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