The effect of the residual stress on the peel strength P/b is discussed.
实验结果还表明，膜内残余应力的存在降低了剥离强度。
The bending stress is zero for the element at b.
在B处的单元体，弯曲应力为零。
We predicted that a gene was more tolerant to heat stress than B gene.
推测A基因可能是耐热基因，B基因可能是非耐热基因。
We predicted that a gene was more tolerant to heat stress than B gene.
推测A基因可能是耐热基因，B基因可能是非耐热基因。
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