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The second stage, says Dr. Neder, is the bonding stage.
内德博士说：第二个阶段是契合阶段。
youdao
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The bonding layer is adhered between the first chip and the second chip.
粘着层粘着于第一芯片与第二芯片之间。
youdao
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The bonding layer is adhered between the first chip and the second chip.
粘着层粘着于第一芯片与第二芯片之间。
youdao