Lead shipment package test, team work with customer on package improve.
主导出货包材测试，与客户检讨包装改善方案；
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
Gold, silver and nickel plating of IC lead frame and package shell.
集成电路引线框架、封装壳体的镀金、镀银、镀镍、镀锡工艺。
All leads are coated with 100% matte tin, and there is no lead inside the package.
所有的引脚均镀以100%雾锡，封装内无铅存在。
All leads are coated with 100% matte tin, and there is no lead inside the package.
所有的引脚均镀以100%雾锡，封装内无铅存在。
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