Hardware mainly includes: track movement control components, pulse power control components, main control components.
硬件上主要包括：轨迹运动控制部件、脉冲电源控制部件、主控部件三个部分。
It is one of the main reasons that induced strike-slip movement of main fault zone.
它是引起主断裂发生走滑的重要原因之一。
And quick wire movement during hot-dipping and inhomogeneous coating was identified as the main cause.
结果表明，钢丝热浸镀时走速过快和镀层不均匀是导致扭转脆性断裂的主要原因。
And quick wire movement during hot-dipping and inhomogeneous coating was identified as the main cause.
结果表明，钢丝热浸镀时走速过快和镀层不均匀是导致扭转脆性断裂的主要原因。
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