The most common conductive material used is copper.
最常见的导电材料是铜。
The material first used was copper for it is easily obtained in its pure state.
最先使用的材料是铜，因为纯属易于炼取。
CO2 is part of the structure of copper oxide material which should be effective.
CO2是这个结构的一部分和加有氧化铜的材料会很有效。
In ancient, copper was adopted as the major chop material.
古代印章材料，大都以铜材为主。
Electric and magnetic performances of the material are different from ordinary copper alloy.
这种材料的电、磁性能明显区别于普通的铜合金材料。
Other than austenite, copper element dissolution is found in material.
母材区除了奥氏体组织外，存在铜元素的扩散。
Other than austenite, copper element dissolution was found in material.
母材区除了奥氏体组织外，存在铜元素的扩散。
Pure Copper base material ensures excellent heat dissipation.
纯铜基底确保散热效果。
Said invention uses the electroplating method to prepare the thin copper-clad invar sheet material.
本发明是利用电镀法制备薄覆铜因瓦片材。
Said invention uses the electroplating method to prepare the thin copper-clad invar sheet material.
本发明是利用电镀法制备薄覆铜因瓦片材。
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