Wozniak was the hardware genius, the chip-head engineer, but Jobs understood the whole package.
沃兹尼亚克是一位硬件天才，一个芯片工程师。但乔布斯了解所有的事情。
They can be classified into wafer level, chip level, and package level stacking.
它们可以分为圆片级封装、芯片级封装、和封装面。
Picture: Latest chip and package technology for the mid-range power class.
图片：最新的芯片和封装技术为中档功率等级。
The package includes a chip carrier which has a metal substrate.
所述封装包括有金属基片的芯片支座。
LED using import LED chip for package.
发光二极管采用进口LED芯片封装。
LED using import LED chip for package.
发光二极管采用进口LED芯片封装。
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