Flip chip technology has become one of the major joining technologies in electronic packaging.
摘要覆晶技术已成为电子构装中之主要接合技术之一。
Flip chip technology has become one of the major joining technologies in electronic packaging.
覆晶技术已成为电子构装中之主要接合技术之一。
The process of flip chip based on aluminum nitride is studied.
研究了以氮化铝为基板的倒扣封装的工艺。
The process of flip chip based on aluminum nitride is studied.
研究了以氮化铝为基板的倒扣封装的工艺。
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