摘要覆晶技术已成为电子构装中之主要接合技术之一。

Flip chip technology has become one of the major joining technologies in electronic packaging.

youdao

覆晶技术已成为电子构装中之主要接合技术之一。

Flip chip technology has become one of the major joining technologies in electronic packaging.

youdao

引信信息装定采用高频无线电数据传输技术。

The fuze data of the remote setting are transferred by RF.

youdao

引信信息装定采用高频无线电数据传输技术。

The fuze data of the remote setting are transferred by RF.

youdao