金说“我们证实了我们可以在单元芯片级做到这个。”

"We clearly demonstrated that we can do it at the unit chip level," says Kim.

youdao

可将其看作松耦合架构按比例缩小至芯片级。

Think about the loosely-coupled architecture being scaled down to the chip level.

youdao

它们可以分为圆片级封装、芯片级封装、和封装面。

They can be classified into wafer level, chip level, and package level stacking.

youdao

它们可以分为圆片级封装、芯片级封装、和封装面。

They can be classified into wafer level, chip level, and package level stacking.

youdao