从电路和版图设计两方面论述了该电路整个设计过程。
The design procedures of both circuit and mask pattern are considered.
标准逻辑单元，存储电路设计及输入输出单元版图设计。
在整套工艺环节中，光掩模版图设计和湿法腐蚀是两个关键步骤。
The mask design and the wet etching are both key processes in the technology introduced.
最后讨论了实验的整体流程并对版图进行设计。
设计了工艺版图和工艺流程。
在整个设计流程中，无论是电路还是版图均采用全定制方法设计。
Both schematic design and physical design of them are completed by full custom method.
在整个设计流程中，无论是电路还是版图均采用全定制方法设计。
Both schematic design and physical design of them are completed by full custom method.
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