这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。

The model and the simulation results can be the reference in design of bonding process.

youdao

这一模型和模拟结果对硅-硅直接键合设计有一定参考价值。

The model and the simulation results can be the reference in design of bonding process.

youdao