Printing capabilities include thru hole, multi layer, low TCR resistors, thermistors, and 5 mil line and space capability. Substrates of up to 4 inch X 5 inch can be accommodated.
可以印刷透孔、通孔层、电阻温度系数较低的电阻、热敏电阻,5毫升容量。
Printing capabilities include thru hole, multi layer, low TCR resistors, thermistors, and 5 mil line and space capability. Substrates of up to 4 inch X 5 inch can be accommodated.
可以印刷透孔、通孔层、电阻温度系数较低的电阻、热敏电阻,5毫升容量。
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