A work function metal layer may be formed on the interface layer.
功函数金属层可形成在界面层上。
Wet etching: Use wet etching for metal layer and ITO conductive layer.
湿蚀刻：对于金属层和ITO导电层使用湿蚀刻进行蚀刻。
In yet another embodiment, metal layer (16) is a damascene copper layer.
然而，在另一个实施例中，金属层(16)是镶嵌铜层。
The high resistance film layer (such as V2O5) is formed on the surface of the metal layer.
该高阻值膜层(例如V2O5)形成于该金属层表面。
The first soft metal layer and the second soft metal layer are made of tin alloy or lead alloy.
第一软金属层和第二软金属层采用锡合金或铅合金材料。
The dielectric layer is arranged between the solid state electrolyte layer and the metal layer.
而介电层是在固态电解质层与金属层之间。
The metal layer can comprise molybdenum metals and is formed on the rough surface of the substrate.
金属层可包含钼金属，且形成于基板的该粗糙面上。
The invention further relates to the use of carbon nanotubes for applying a metal layer to a substrate.
本发明进 一步涉及碳纳米管在施加金属层至基质中的用途。
An opening is formed at the second metal layer above the etch stop layer to expose the etch stopping layer.
在蚀刻停止层上方的第二金属层形成一开口，使蚀刻停止层暴露出来。
The base electrode (3) is a metal layer deposited on top of the semiconducting material forming the first electrode.
基极电极(3)是沉积在形成第一电极的半导体材料上面的金属层。
There is a ferromagnetic-based body (192) located on the first metal layer that has a ferromagnetic inner core area.
在第一金属层上布置着具有铁磁内芯区域的铁磁体（192）。
The method of manufacturing the same comprises: forming the first metal layer on an original disc with the fine pattern;
制造方法为：在表面具有细微图案的原盘上形成第一金属层；
Needed In machining process, tool directly involved in cutting process, from metal layer of workpiece excision redundant.
在机械加工过程中，刀具直接参与切削过程，从工件上切除多余金属层。
An electrical connection is provided to the metal layer and semiconductor layer and a magnetic field applier may be also provided.
给金属层和半导体层提供电连接，还可以提供磁场施加器。
The third stage etching in current method is a time-fixed etching, which easily causes under etching or over etching of the metal layer.
现有的刻蚀形成金属线时的第三阶段刻蚀采用了固定时间的刻蚀，极易造成金属层刻蚀不足或过刻蚀的问题。
Numerical computations of acoustic reflection coefficients are given for aluminum alloy adhesive joints and metal layer embedded in rock.
本文给出了铝合金粘接件和含矿地层声反射系数的数值计算结果。
The results show that the stress-impedance effect increases with the increase of the thickness of the ferromagnetic layer and metal layer.
结果表明，增加铁磁层和导电层的厚度都会增强多层膜的应力阻抗效应。
The results show that the stress-impedance effect increases with the increase of the thickness of the ferromagnetic layer and the metal layer.
结果表明，铁磁层和中间导电层厚度的增加都会增强多层膜的应力阻抗效应。
The metal layer may include two nickel layers and one copper layer sandwiched between the nickel layers and in the thickness of 20-100 nm each.
该金属层可包括一铜金属层及两镍金属层，其中该铜金属层夹于该二镍金属层之间；且该铜金属层及该镍金属层的厚度为20- 100纳米范围内。
Nc sheet metal incremental forming technology is a flexible forming method, it forms the sheet metal layer by layer by a three-axis forming facility.
金属板材数控渐进成形技术，是一种通过三轴数控成形机对金属板材进行逐层辗压而成形工件的柔性加工技术。
At least one other metal layer (198) is on the ferromagnetic-based body and arranged as a second set of adjacent non-intersecting conducting segments.
在铁磁体上存在至少一个其他金属层(198)，其被布置为第二组相邻非交叉导电部分。
The barrier metal layer contains phosphorus, and includes a phosphorus-rich portion where the phosphorus content is higher than that at other portion.
该金属屏蔽层含有磷，且具有含磷率大于其它部分的富磷部位。
A new viewpoint was advanced, in which the plastic flow of metal layer to be cut becomes the cutting burr, and it was confirmed by experimental results.
并提出了被切削层金属沿刀具切削刃向工件两侧的自由表面产生塑性流动是形成两侧方向毛刺主要原因的新观点，得到了试验结果的证实。
The incomplete connection between the spray end of metallized capacitor and metal layer of polymer film is the main cause of capacitor damage and failure.
电容器端部喷金层与膜上金属蒸镀层的不完全连接性，是电容器损坏的主要原因之一。
The anode and the cathode are arranged in the electrolyte. The anode is of the shape of a columnar roller and the metal layer is in contact with the anode.
所述阳极及阴极都位于所述电解液内，其中所述阳极具有一圆柱滚轮的外形，且所述金属层接触所述阳极。
The first soft metal layer and the second soft metal layer are correspondingly plated on the contacts of the positive pole and the negative pole of the dry battery.
第一软金属层和第二软金属层是对应镀在干电池的正电极的触点上及负电极的触点上。
Electroplating: use the principle of electrolysis, the metal and alloy parts deposition in the surface, form even, density, good adhesion of the metal layer process.
电镀：利用电解原理，使金属或合金沉积在制件表面，形成均匀、致密、结合力良好的金属层的过程。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The metal layer in the recessed area is polished to a height below the non-recessed area, wherein the height is equal to or greater than a thickness of the barrier layer.
凹进区域的金属层被抛光到非凹进区域以下的高度，其中所述高度等于或大于所述屏障层的厚度。
The image forming substrate further comprises a metal layer positioned on at least the emission regions, and at least one electron collector positioned in the non-emission region.
图像形成基板还包括设置在发射区上的金属层和设置在至少一个非发射区上的至少一个电子收集器。
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