The wafers are used by our customers to fabricate into LED devices (LED chips).
客户用我们的外延片来生产LED芯片。
The defective and damaged LED chips appearing in the production process were analyzed and classified.
对LED芯片生产过程中出现的缺陷和损坏现象进行了分析和归类。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本发明涉及一种倒装led芯片的封装方法，属于LED制造领域。
The noise power spectra of the non-contact detection system for LED chips and the noise suppression methods are discussed.
分析了LED芯片非接触检测系统噪声信号的功率谱，研究了噪声信号的抑制方法。
The noise power spectra of the non-contact detection system for LED chips and the noise suppression methods are discussed.
分析了LED芯片非接触检测系统噪声信号的功率谱，研究了噪声信号的抑制方法。
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