Current status and trend of lead-free technology have been reviewed for electronic assembly manufacturing at home and abroad.
论述了国内外电子组装生产中无铅技术的现状及发展趋势。
It covers the background, solders, surface finishes, components, substrates, assembly processes, rework, and reliability of lead-free soldering.
包括背景，焊料，表面镀层，元器件，基板，组装工艺，返工和无铅焊接的可靠性。
With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.
随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。
With the increasing requirement of Lead-free electronics assembly, the patent problem on the alloy composition of Pb-free solders has also been greatly concerned.
随着无铅化电子组装需求的日益迫切，人们也越来越关注无铅焊料合金成分的专利问题。
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