An ultrahigh wavelength stabilization was designed by adopting a new integrated semiconductor LD module with a wavelength-monitor.
采用集成有检波器件的LD组件，设计了高精度的激光波长稳定系统。
The Quad PD Arrays consist of four photodiodes monolithically integrated on a common indium phosphide (InP) substrate, and are fabricated using a low FIT rate InGaAs/InP semiconductor process.
方形光二极管阵列包括四个集成在通用磷化铟（InP）衬底上的光二极管单片集成电路，采用低制造、集成与测试率的铟镓砷化物/磷化铟半导体工艺制造。
The semiconductor business is becoming less vertically integrated and more concentrated. And its centre of gravity is shifting eastwards.
半导体业务正从纵向一体化向更多的集聚转变，并且它的重心正向东方转移。
All of the currents (in virtually all integrated circuits) are confined to a very thin region near one face of a semiconductor crystal.
所有的电流(在所有的集成电路中)实际上局限于靠近半导体晶体面非常薄的区域内。
To address the above-described challenges, IBM's System Technology Group (STG) semiconductor manufacturing created solution based on an integrated modularized architecture.
为了处理上述挑战，IBM的 System Technology Group (STG)半导体制造部门基于集成的模块化体系结构创建了一套解决方案。
This is a semiconductor integrated circuit.
这是一个半导体集成电路。
With the development of semiconductor process technology, nowadays a system on a PCB (Printed Circuit Board) which is composed of several ICs can be integrated into a chip.
随着集成电路制造工艺的飞速发展，人们已经可以将原先用各种电路搭建的板极系统集成在一块芯片上。
With the rapid development of semiconductor technology, integrated circuit has stepped into a new era of SOC.
随着集成电路工艺与技术的飞速发展，集成电路已经进入系统级芯片阶段。
This kind of tester has a enormous practical prospect in many fields, such as electronic glass, semiconductor, integrated circuit, thin films and technology of nanometer.
这种测试仪在电子玻璃、半导体、集成电路、薄膜和纳米技术等领域都具有很大的应用前景。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
The silicon chip is a main component of the semiconductor apparatus; there is extensive application in printing the integrated circuit and miniature integrated instrument.
硅片是半导体器材的主要元件，在印刷集成电路及微型集成仪表中有着广泛应用。
Semiconductor devices. Discrete devices and integrated circuits. Part 8: field-effect transistors.
半导体器件。分立器件和集成电路。第8部分：场效应晶体管。
This paper introduces a simple and easy temperature measuring and controlling system made up of a new -type temperature-measuring integrated circuit DS1820 and semiconductor refrigerator.
介绍了一种使用新型测温集成电路ds1820和半导体致冷器件组成的简单精巧的温度测控系统。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.
本文首次利用时域有限差分(FDTD)法分析了高速集成电路芯片内半导体基片上的有耗互连传输线的电特性。
IGCT is a kind of high power semiconductor based on GTO structure, which achieves hard turn-off by the integrated gate circuit.
IGCT是一种基于GTO结构并利用集成门极电路进行硬驱动控制的大功率半导体开关器件。
This article introduces the application of specialty gases in electronics industries, such as integrated circuit, solar cell, compound semiconductor, TFT-LCD and optical fiber perform.
论述了特种气体在集成电路、太阳能电池、化合物半导体、液晶显示器和光纤预制棒等电子行业中的应用，并就其使用安全提出了建议。
Write prohibition circuit, semiconductor integrated circuit containing the same, ink cartridge having this semiconductor integrated circuit, and ink jet recorder.
写入禁止电路，使用了该电路的半导体集成电路，具有该半导体集成电路的墨水匣以及喷墨记录装置。
Design and realization methods of integrated operational amplifier feedback constant current power in semiconductor laser reliability evaluation system are introduced in this paper.
介绍一种已成功应用于半导体激光器可靠性评估系统的负载浮置的集成运放反馈型恒流源的设计与实现方法。
A monolithic integrated two-dimensional array can be manufactured by using surface-emitting semiconductor lasers.
采用表面发射半导体激光器，可制作单片集成的二维列阵。
But PLLs design process involves much theory and application base, such as signal and system, integrated electronics, layout, semiconductor technology, measurement etc.
但是锁相环的设计过程，涉及到信号与系统、集成电子学、版图、半导体工艺和测试等方面，难度比较大。
The paper introduces a hybrid integrated functional module for the temperature autocontrol of semiconductor lasers.
本文介绍了一种适用于半导体激光器自动温度控制的混合集成功能单元。
In this paper, advances of surface-emitting semiconductor lasers and monolithic integrated two-dimensional arrays composed of these devices are reviewed.
本文评述表面发射半导体激光器及其单片集成的二维列阵的进展。
Integrated temperature sensors are made by using silicon semiconductor integrated technologies, so also called silicon sensors or the single-chip integrated sensors.
集成温度传感器是采用硅半导体集成工艺而制成的，亦称硅传感器或单片集成传感器。
With the rapid improvement of VLSI technology and semiconductor technology, the large amounts of hardware which is needed by vector processing can be integrated in a single chip.
VLSI技术和半导体工艺的飞速发展，使向量处理所需的大量硬件可以集成在一块芯片内。
Owing to their specialized structures and minute diameter, it can be utilized as a sensor device, semiconductor, or for components of integrated circuits.
由于他们特殊的结构和微小的直径，可以被用于传感器装置、半导体或者集成电路的组件中。
The present invention brings forward a method for determining leakage currents in integrated circuit and metal oxide semiconductor element.
本发明提出一种集成电路及金属氧化物半导体元件中判断漏电流的方法。
Semiconductor diodes bipolar junction transistors field-effect transistors transistor amplifiers frequency response operational amplifiers differential and multistage amplifiers integrated circuits.
半导体、二极体、双极电晶体、场效电晶体、电晶体放大器、频率响应、算放大器、差动及多极放大器、积体电路。
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits.
半导体器件。集成电路。第20部分：薄膜集成电路及混合薄膜集成电路的总规范。
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits.
半导体器件。集成电路。第20部分：薄膜集成电路及混合薄膜集成电路的总规范。
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