Since then graphene has become one of the hottest topics in semiconductor materials science.
此后石墨烯已经成为半导体材料科学领域最热门的研究方向之一。
The materials can be made in a variety of morphologies and could be used in semiconductor devices, optics or batteries.
这种纳米材料可以制成不同的形态，能用于半导体、光学、电池等领域。
The motion of electrons or holes in semiconductor in electric field.
半导体中电子或空穴在电场中的运动。
Content and methods of shop-floor control in semiconductor wafer fabricati…
本文介绍了半导体晶圆制造车间层控制的内容及方法。
This is a survey lecture on energy transport models in semiconductor science.
这是一篇关于半导体材料科学中能量输运模型的综述性文章。
The properties of the effective mass of polaron in semiconductor quantum dot are studied.
研究了半导体量子点中极化子的有效质量。
Plasma processing technology is a new technology developed in semiconductor manufacturing.
等离子体加工技术是在半导体制造中创立起来的一种新技术。
Phase noise in semiconductor laser due to external optical feedback is investigated theoretically.
本文在理论上研究了由于外部光反馈引起的半导体激光器的相位噪声。
LOCOS is the mature technology, which is used widely for the isolation in semiconductor micron times.
硅的局域氧化工艺是一个非常成熟的工艺，在微米时代有着广泛的应用。
At least 2 years working experience, and had working experience in semiconductor industry is preferred.
至少2年相关工作经验，有半导体行业经验者优先。
Working knowledge with ANSYS is preferred. Experience in semiconductor manufacturing is an added advantage.
具备ANSYS 相关知识和半导体制造相关工作经历者优先。
The place that exists in PBG structures is similar with the bandgap in semiconductor called photonic band gap.
光子带隙结构中存在着类似于半导体中的禁带，称为光子带隙。
The field-enhanced carrier generation of deep level centers in semiconductor space charge region has been studied.
本文研究了半导体表面空间电荷区中的深能级中心的电场增强载流子产生效应；
Silicone resin modified polyester(SP) is a kind of ultra-pure surface protection material used in semiconductor device.
聚酯改性硅漆（SP）是用于硅器件表面保护的高纯绝缘材料。
An instrument based on area array CCD devices for measuring stresses in semiconductor materials is studied and realized.
研究和实现了采用面阵CCD器件的半导体材料应力测试仪。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
The element is used to harden certain steels, among other metallurgical uses, and is also used in semiconductor devices.
广泛用于提高钢的淬硬性以及其它冶金工业，也用作半导体。
The research of radiation damage in semiconductor materials is the basis of that in electronic systems and their hardening.
半导体材料的辐射损伤研究是电子系统辐射损伤及其加固研究的基础。
Discusses the gold diffusing with gold chloric acid substituted for gold evaporation habitually used in semiconductor technology.
探讨采用氯金酸金扩散代替惯用的蒸金扩散工艺。
It can be used for investigation to detect defects and shallow impurities, and to show their distributions in semiconductor materials.
它可以用来探测材料中的缺陷及浅能级杂质，显示其分布。
Mainly the author of this essay elaborates that Taguchi parameter design controls the linewidth quality in semiconductor manufacturing.
本文着重论述了田口式参数设计法在半导体制造中对线宽的质量控制。
This is a photonic impurity state, similar to the impurity level in semiconductor. The introduction of impurity layer increased the width…
杂质层的引入增宽了原来光子禁带的宽度，杂质态的特征与杂质层的光学厚度、 折射率及在晶体中的位置等因素有关。
The world leading place in semiconductor industry made Japan have a solid foundation of components for active phased array radar development.
日本半导体工业在世界上的领先地位为其研制有源相控阵雷达提供了扎实的器件基础。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
In the paper, the properties of weak-coupling exciton in semiconductor quantum dot are studied by using the method of a linear-combination operator.
采用线性组合算符方法研究了半导体量子点中弱耦合激子的性质。
OVIVO Shanghai shall continuously focus on all water treatment needs in semiconductor and microelectronics industry as a turnkey solutions provider.
OVIVO上海仍将一如既往主要为半导体、微电子行业的客户提供水处理全套解决方案。
In this paper, we apply ADI and high-order compact finite difference method for large-scale asymmetric sparse matrix in semiconductor device simulation.
采用AD I与高阶紧致差分相结合的方法计算大型非对称稀疏矩阵，并实现了该算法在半导体器件模拟中的应用。
With the increase of the number of parameters in semiconductor devices, the dimensions of space in which the object function exists become larger and larger.
随着半导体器件参数的增加，目标函数的自变量空间维数变得越来越大。
The chirp performance of converted signal in wavelength conversion based on cross gain modulation (XGM) in semiconductor optical amplifier (SOA) was analyzed.
对基于半导体光放大器中交叉增益调制效应的波长转换后信号的啁啾特性进行了分析。
The chirp performance of converted signal in wavelength conversion based on cross gain modulation (XGM) in semiconductor optical amplifier (SOA) was analyzed.
对基于半导体光放大器中交叉增益调制效应的波长转换后信号的啁啾特性进行了分析。
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