Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
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