• The new method of producing basic copper carbonate from waste etching solution containing copper.

    介绍了利用含铜蚀刻废液合成碱式碳酸铜的新工艺。

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  • Nanometer copper powders were prepared from acidic waste etching solution containing copper using hydrazine hydrate as a reductive agent.

    以酸性蚀刻废液为铜源,水合肼为还原剂,采用液相还原法制备纳米铜粉。

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  • The working principle, characteristics and application status and trend of a new type of centrifugal extractor in alkaline etching solution recycling were introduced.

    介绍了新型离心萃取机的工作原理、特点及其在碱性蚀刻液再生循环中的应用状况及前景。

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  • The invention relates to a surface treatment method of plastic components, comprising the following steps: providing an inkjet device housing etching solution inside;

    本发明涉及一种塑胶元件表面处理方法,该方法包括:提供一喷墨装置, 该喷墨装置内收容有蚀刻溶液;

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  • Some introductions are conducted on the production techniques, technical characteristics, flows and quality of products in the copper recovery from the waste etching solution.

    介绍了利用含铜蚀刻废液回收铜的生产工艺、技术特点、工艺流程和产品质量。

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  • Effect of potassium permanganate etching solution on the roughening of epoxy resin laminates board and 3240 epoxy resin board at various temperatures and times was investigated.

    在不同的微蚀温度、时间条件下,研究了高锰酸钾微蚀溶液对环氧树脂层压板和3240型环氧树脂板(基板)微蚀作用的影响。

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  • Traces of sulfate ions in etching solution for aluminum foil have been determined by turbidimetry in presence of cation surface activator-hexadecyl trimethyl ammonium bromide (CTMAB).

    在阳离子表面活性剂——十六烷基三甲基溴化铵(CTMAB)的存在下,用比浊法对铝箔蚀腐液中微量硫酸根离子进行测定。

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  • According to the process condition and surface appearance of aluminium alloy after alkaline etching, etching solution was maintained. The common failure and trouble shooting were presented.

    根据铝合金碱蚀工艺条件和铝材碱蚀后的表面状况,对碱蚀槽的槽液进行维护,提出了碱蚀常见故障和排除方法。

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  • Specimens prepared by polishing and etching in a weak solution of nitric acid and alcohol reveal the lamellar structure of alternating plates that forms on slow cooling.

    通过打磨并在弱硝酸酒精溶液中蚀刻制备的样本显示出由缓慢冷却形成的交互层状的薄片结构。

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  • Two mutually vertical fibers coupling grooves are fabricated by using anisotropic etching of the(110) silicon in the KOH solution.

    利用(110)硅片在KOH溶液中各向异性腐蚀制作出两个互相垂直的光纤定位槽。

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  • Etching silicon tips in anisotropic KOH solution has the advantages of simple, easy to handle, low cost and homogeneous etching rate of (100) crystal plane on a whole wafer.

    各向异性KOH溶液腐蚀硅尖具有简单、易于实现、成本低廉、(100)晶面腐蚀速率均匀等优点。

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  • The etching effect factors such as solution concentration, temperature, reaction time and ultrasonic stirring etc were also investigated.

    分析了酸性溶液中酸浓度、溶解温度、溶解时间和超声波作用对多组分磷酸盐玻璃化学浸蚀的影响。

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  • The experiments also reveal the relation between the etching rate of glass and the temperature of solution as well as the relation bet…

    实验还得出玻璃的腐蚀速率和温度的关系以及光刻胶的耐蚀时间和温度之间的关系。

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  • The experiments also reveal the relation between the etching rate of glass and the temperature of solution as well as the relation bet…

    实验还得出玻璃的腐蚀速率和温度的关系以及光刻胶的耐蚀时间和温度之间的关系。

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