The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
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