The superposition of pulsed current on the electroless reaction is referred to the pulsed electroless plating.
脉冲化学镀是指在化学镀上叠加脉冲电流。
The catalytic effects of metallic substrates in the initiation of electroless reaction were studied with the analysis of potential vs time curves.
通过电位—时间曲线的特征，研究了化学镀镍反应初期不同基体材料的催化特征。
Electroless copper depositing processess are controlled by the kinetics of formaldehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.
化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。
The formation and growth kinetics of the intermetallic compounds through reaction between liquid Zn and low carbon steel containing Si which is treated by electroless pre-plating ni are analyzed.
采用预镀镍的方法，研究了含硅低碳钢预镀镍后与液态锌的反应以及金属间化合物组织的形成和变化规律。
Comparison experiment results show that the failure is not caused by the permeation of plating solution but by the reaction happened in the electroless nickel plating.
通过对比实验发现，这些样品的失效不是由于镀液的渗透引起的，而是与化学镀镍过程中的化学反应有关。
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
It was proposed that the reducing agent of electroless plating solution could have some reducing reaction to the grain boundary of PTC ceramics and thus had influence on PTC effect.
提出了化学镀镍溶液中的还原剂对PT C陶瓷的晶界产生还原从而影响PTC效应的观点。
It was proposed that the reducing agent of electroless plating solution could have some reducing reaction to the grain boundary of PTC ceramics and thus had influence on PTC effect.
提出了化学镀镍溶液中的还原剂对PT C陶瓷的晶界产生还原从而影响PTC效应的观点。
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