Metallic bonding can realize up -down assembly and improve the thermal property. But it has little influence on the original optical property of the device.
金属键合可以实现衬底倒扣和改善器件热学性能，而对器件原有的光学性质影响不大。
Metallic bonding can realize up -down assembly and improve the thermal property. But it has little influence on the original optical property of the device.
金属键合可以实现衬底倒扣和改善器件热学性能，而对器件原有的光学性质影响不大。
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