Objective: To observe the effects of cooking oil fume (COF) on cellular immunity of rats.
目的：观察烹调油烟对大鼠细胞免疫功能的影响。
Objective To observe the liver tissue lesion and its mechanism in SD rats inhaled cooking oil fumes (COF).
目的通过观察肝组织脂质过氧化和元素含量的变化，探讨烹调油烟致肝损伤的毒作用机理。
In this paper, the structure, features, key process, applications and developing direction of COF are summarized.
本文就COF的结构，特点，所用材料，关键工艺，应用状况及其发展趋势进行了综述。
We also made the COF using frame memories and digital BPF and adders and digital balancer. The COF filter's feature is required.
利用帧存储器作延迟线，结合数字带通滤波器、加法器和数学平衡器等组成数字梳状滤波器，形成所需要的滤波特性。
The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency(RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
这一新型的DDI装置相比传统的COF能提高散热量达20%，因此使得DDI能运行更长时间，并且可靠性更好。
A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices.
研究的激光融除工艺能够使所选择的COF叠层区域有效融除，而对封装的MEMS器件影响最小。
The nano-alumina dispersion solution can then be mixed with an imide coating to provide for a wire coating to give the wire improved abrasion, COF, and corona resistance.
纳米氧化铝分散体溶液可与酰亚胺涂料混合，提供漆包线漆涂层，得到耐磨性、COF和耐电晕性得到改进的线 材。
This paper describes the characteristic and fabrication technology of COF(Chip on Film)tape for large-scale LCD(Liquid Crystal Display), and fine pitch wiring formation technology.
概述了大型液晶显示用COF带的特征和制造技术以及细节距线路形成技术。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
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