Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.

有时，较低的口模温度会在口模内表面上生成一个冷却的树脂层，这个树脂层慢慢地移出到口模出口，然后与本体料流分离，从而引起积料。

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Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.

有时，较低的口模温度会在口模内表面上生成一个冷却的树脂层，这个树脂层慢慢地移出到口模出口，然后与本体料流分离，从而引起积料。

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