• The results showed that the thin film is mainly composed of Si-C bond.

    分析结果表明我们的样品是以碳硅键为主的薄膜。

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  • A C-F cleavage reaction was found when using ortho-fluoro substituted benzonitrile, which resulted in the formation of new C-C bond.

    发现该反应在以邻位氟取代的苯睛为底物的情况下,碳-氟键可以被打断并有效地形成碳-碳键。

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  • The catalytic action of cellulose oxyphosphine palladium complexs in the crosscoupling reaction of organotin reagents with acid chlorides for forming C-C bond is presented.

    报道了纤维素氧膦 -钯配合物在有机锡试剂与酰氯化合物形成碳 -碳键的交叉偶联反应中的催化作用 ,并对部分反应条件及反应机理进行了研究和探讨。

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  • DAST is one of the most important fluorinating agents in this century. This paper has summarized the recent advances in the formation of C-F bond by DAST.

    DAST试剂是本世纪开发的最重要的氟化试剂之一,本文综述了利用该试剂形成碳-氟键的新进展。

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  • The organic fluorine paint contains C-F bond and has many particularly excellent performance.

    有机氟涂料含有C-F键,具有许多特殊优异的性能。

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  • In- termolecular reactions were observed with the C—Pd bond formed by the C—H activation of the aromatic ring and the nitrile group.

    当然,人们也观察到了通过芳香C—H键活化产生的芳基碳钯键与腈基的分子间反应。

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  • Obvious changes of atomic natural charge happened to atoms C(1), H(11), O(28), O(29) and N(27). The bond lengths and bond angles related to these atoms were also varied greatly.

    参与新键形成和旧键断裂原子C(1),H(11),O(28),O(29)和N(27)的原子自然电荷及与其相关的键长、键角有明显的变化。

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  • The C-H bond activation is the rate-limiting step.

    C-H键活化为整个反应的决速步骤。

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  • Raman spectroscopy results showed that: the presence of electron withdrawing groups improved the bond energy of C-H in the benzene ring.

    拉曼光谱分析结果证明:吸电子基团的存在使苯环上c -H的键能提高。

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  • The entrance channel of the C-H bond activation step involves the spin cross between the singlet and triplet potential energy profiles.

    C-H键活化步骤涉及势能面交叉,且自旋交叉与动力学相关。

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  • There is a potential weak intermolecular hydrogen bond through C(8)—H(8A)…O(1), which stabilizes the structure of the title compound.

    从晶胞堆积图中可看到,通过C(8)—H(8A)…O(1)有一潜在的弱的氢键,使标题化合物的结构更稳定。

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  • The reaction rate is determined by the activity of C-H bond in side-chain alkyl.

    其反应速度主要取决与侧链烷基上c - H键的活性。

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  • The results show that the hydrogen of C—H bond on ACFs were substituted by fluorine at different condition. The C—F covalence bond was built at molecular level.

    结果表明,随着反应时间和温度的变化,活性炭纤维表面氟取代氢基数目增加,同时在分子水平上形成C—F共价键。

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  • Ring closing metathesis (RCM) of dienes to cycloalkene provides an important tool for C-C double bond formation catalyzed by metal carbene.

    关环转换反应是形成碳碳双键的重要反应之一,即双烯化合物在金属碳烯催化下关环得到环烯类化合物。

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  • Schiff base is the Types of organic compounds which contain C-N double bond of the imine or azomethine group characteristics. the early research focus on Amine Schiff base reduction.

    席夫碱主要是指含有碳氮双键的亚胺或甲亚胺特性基团的一类有机化合物,早期的研究一般为缩胺类席夫碱。

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  • An increase in the specific surface area of the alumina pellets enhances the HCHO removal, and this indicates that the adsorbed HCHO species may have a lower C-H bond breakage energy.

    氧化铝小球比表面积的增加能够促进甲醛的脱除,这表明被氧化铝吸附的HCHO分子的C-H键的解离能被有效降低。

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  • The compounds play a favourable role in the auxoaction for the bond formation of C-C and C-N.

    将该肟膦化合物用作配体,可分别对C-C和C-N键的形成起到很好的促进作用。

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  • Whereas, C-C1 bond is hardly broken.

    碳—氯键则几乎没有开裂。

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  • C-UV4111 is used to bond, seal metal or glass components with high strength and chemical resistance.

    该产品在紫外光照射下固化,用于粘接和密封金属或玻璃元件并具有高强度和耐化学腐蚀性。

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  • The organic group further comprises at least one activating group on at least one carbon atom of the C-C single bond or double bond.

    所述有机基团进一步包括至少一个在所述C-C单键或双键的至少一个碳原子上的活性基团。

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  • The material cures when exposed to ultraviolet radiation. C-UV4111 is used to bond, seal metal or glass components with high strength and chemical resistance.

    该产品在紫外光照射下固化,用于粘接和密封金属或玻璃元件并具有高强度和耐化学腐蚀性。

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  • The material cures when exposed to ultraviolet radiation. C-UV5222 is used to bond, seal metal or glass components with high strength and chemical resistance.

    该产品在紫外光照射下固化,用于粘接和密封金属或玻璃元件并具有高强度和耐化学腐蚀性。

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  • The effect c EVA and fillers on bond strength for PP was studied in the hot melt adhesive;

    探讨了热熔胶中EVA以及填料对聚丙烯粘接强度的影响;

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  • The effect c EVA and fillers on bond strength for PP was studied in the hot melt adhesive;

    探讨了热熔胶中EVA以及填料对聚丙烯粘接强度的影响;

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