The thermal resistance of DSOI devices is very close to that of bulk devices and DSOI devices can keep this advantage into deep sub-micron realm.
DSOI器件的衬底热阻和体硅器件非常接近，并且在进入到深亚微米领域以后能够继续保持这一优势。
The thermal resistance of DSOI devices is very close to that of bulk devices and DSOI devices can keep this advantage into deep sub-micron realm.
DSOI器件的衬底热阻和体硅器件非常接近，并且在进入到深亚微米领域以后能够继续保持这一优势。
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