一些类型的口模积料会很快氧化并变成棕色或者黑色。
Some types of die buildup oxidize quickly and turn brown or black.
对着口模出口进行空气吹扫能帮助减少和控制积料。
Air sweeps pointed at the die exit can help reduce and control buildup.
有时，较低的口模温度会在口模内表面上生成一个冷却的树脂层，这个树脂层慢慢地移出到口模出口，然后与本体料流分离，从而引起积料。
Sometimes lower die temperatures can create a cool layer of resin on the inner surface of the die that creeps slowly to the die exit and then separates from the bulk flow, causing buildup.
清除积料后在口模出料口使用脱模剂或者硅酮可以减轻积料程度并延长两次清除之间的时间。
Applying mold release or silicone to the die exit area after cleaning can reduce the rate of buildup and extend the time between cleanings.
例如，高度不相容的聚合物熔融掺混时，常常出现极度的口模积料。
For example, extreme die buildup often occurs when highly incompatible polymers are melt blended.
如果发生口模积料，尝试使用别的供应商的类似牌号。
If die buildup occurs, try a similar grade from another supplier.
对于简单的口模形状，可以在线运行时进行积料清除。
Simple die shapes allow for cleaning while the line is running.
修改的口模出口据称可以减少口模积料，包括一种方形陡出口、尖形陡出口、弧形过渡形出口、外扩台阶出口、内扩台阶出口、外展形出口(见图)。
Modified die exits that claim to decrease die buildup include a sharp square exit, sharp pointed exit, radiused exit, outward-stepped exit, inward-stepped exit, and outward-flared exit (see diagram).
改变挤出物的牵引角度，就可以改变挤出物在口模上的堆积位置，这样就容易清除积料了。
Changing the Angle at which the extrudate is drawn away from the die can change the placement of buildup on the die and make it easier to clean.
口模积料与口模的出口应力有关。
使用膨胀型复合模铸保护渣保护浇注钢锭，普遍存在的一个问题是容易使钢锭产生头部积渣这一表面缺陷。
A general problem in protecting the casting ingots by using expanded complex mould casting mold powder is the surface defect that slag deposition can be evolved easily in ingots head.
多模光纤存在严重的模式色散，其带宽距离积受限。为此，分析了多模光纤的带通特性。
Becouse multimode fiber has high modal dispersion which limits to its bandwidth distance product, the band pass characteristics of the multimode fiber was analyzed.
根据部分相干光的相干模表示法，推导了由部分相干光源所产生光束的相位一空间积Q。
The generalized expression for the phase-space product Q of a beam generated from a partially coherent source is presented by using coherent-mode representation of partially coherent beams.
你可能想测试口模积料的化学成分以确定里面究竟有什么。
You may want to test the die buildup chemically to see what's in it.
具有窄分子量分布的树脂会有低的出口膨胀，但这不意味着它一定有较少的口模积料。
Resins with narrow molecular-weight distribution can have lower die swell, but this doesn't necessarily mean less buildup.
具有窄分子量分布的树脂会有低的出口膨胀，但这不意味着它一定有较少的口模积料。
Resins with narrow molecular-weight distribution can have lower die swell, but this doesn't necessarily mean less buildup.
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