内部采用高导热灌封材料灌封工艺。
And it USES encapsulating technic of high thermal conductive material inside.
高透明室温硫化有机硅电子灌封胶；
High transparency room temperature vulcanizing potting silicone gelatine;
概述了导热电子灌封硅橡胶的研究背景。
The research background of the liquid thermal conductive encapsulated silicone rubber was summarized.
环氧树脂灌封胶在电子电器工业领域应用广泛。
The epoxy resin sealant has extensive application in the electronic and electrical equipment industry.
研究了汽车点火线圈用聚氨酯灌封料的应用工艺。
This paper introduces the advantage, the technical performance and application of polyurethane potting material used in automobile ignition coils.
灌封是高量程微机械加速度计实用化的一个关键步骤。
Potting is a key step for the packaging of high-g micro-electro-mechanical system(MEMS) accelerometer.
封装结构的模态频率随着灌封胶弹性模量的增大而增大。
The modal frequency of the packaging structure increases with the elastic modulus of potting material.
方法将灌封机上的直筒药液灌注针头，改为“三孔”针头。
Methods We changed straight pinhead to three-hole pinhead of filling & sealing machine in the work of filling liquid medicine.
选用聚合物H和改性异氰酸酯K为主要原料合成聚氨酯灌封胶。
Polyurethane (PU) pouring sealant was synthesized with polymer H and modified isocyanate K as basic materials.
讨论了其主要组分对灌封料性能的影响，并确定了最佳工艺条件。
The effects of primary compounds on the property of the potting compound were studied and the optimum technological factors were determined.
本发明涉及一种耐高温、耐高压的环氧树脂灌封料及其制备方法。
The invention relates to an epoxy resin sealing material capable of resisting high temperature and high pressure and a method for preparing the same.
介绍了电子封装材料绿色阻燃耐开裂环氧树脂灌封料的生产新方法。
A new production method of green electrical packaging material, which can resist fire and crack epoxy resin sealing compounds was introduced.
结果表明，所研制的聚氨酯灌封料性能基本达到PU200的水平。
The result showed that the property of the developed PUR pouring material reached basically the level of PU200.
研究了空气湿度对双组分聚氨酯灌封胶固化过程内部产生气泡的影响。
The effect of air-humidity on bubble of the cured two-component polyurethane was studied.
针对如何解决环氧树脂灌封料在低温下易产生开裂这一问题进行了探讨。
The problem of crack initiation in epoxy resin sealing compounds at low temperature is discussed in this paper.
研制了低黏度环氧灌封胶，进行了配方优化，测试了其力学性能和电性能。
A kind of epoxy pouring sealant was prepared. Its formulation was optimized. The electrical and mechanical properties were determined.
温度是影响整个太阳能电池板真空薄膜灌封系统正常工作的关键因素之一。
Temperature is one of the key factors affecting normal operation of the vacuum membrane pouring and encapsulation system for solar battery plates.
考察了扩链剂种类、活性稀释剂及异氰酸酯对聚氨酯灌封胶力学性能的影响。
The effect of kinds of chain extender, active diluents and the structure of isocyanate on mechanical properties of the elastomer is discussed.
分析了市面上的塑瓶洗灌封设备存在的不足，提出了洗灌封设备的设计需注意的要点。
The deficiencies existed in the equipment for washing, filling and packing plastic bottles supplied in market were analyzed in this article.
针对工件灌封优良率不高，灌封涉及的参数较多的状况，运用田口方法进行了方案优化设计。
Using Taguchi Methods to optimize the design of the project because of the situation of the low workpiece choiceness and more parameter involved.
随着电子器件的小型化、轻量化及高性能化，电子领域对灌封材料的性能提出了更高的要求。
With the development of electronic device miniaturization, the lightweight and the high performance, high-performance encapsulating materials were required.
电子工业用加成型液体硅橡胶灌封料的关键技术指标为：胶料黏度、硫化胶力学性能和电性能。
The key properties of additional liquid silicone potting material in electronic industry are viscosity, mechanical property and dielectric property.
探索制备环氧树脂灌封材料的新方法，寻求高性能化的灌封材料已成为该领域研究的重要课题。
It is one of the most important projects to look for a kind of encapsulating materials and research the new methods of preparing it.
在现代灌封操作中，要求灌封设备应该更加微型化，操作过程更加自动化，人机界面更加友好。
Encapsulating equipments are now required to be smaller, more automatic in operation, and friendly in HMI.
公司拥有领先的环保灌封防水密封材料生产设备，实验室和业内从业多年的核心研发技术团队。
The company has a leading environmental protection sealing material production equipment, laboratory and the core technology research and development team working for many years in the industry.
介绍了一些航空电器产品对灌封材料的要求及双组份聚氨酯泡沫灌封料在航空电器产品中的应用。
This article introduces some requirements of aviation electric apparatus to packing materials and a two-pot polyurethane foam pouring compound for this purpose.
从能量吸收和应力波传播两方面研究了高冲击下电子线路灌封材料的缓冲机理及材料的选用准则。
The cushioning mechanism and selecting rules of sealing materials were analyzed from energy-absorption and stress wave spread.
从能量吸收和应力波传播两方面研究了高冲击下电子线路灌封材料的缓冲机理及材料的选用准则。
The cushioning mechanism and selecting rules of sealing materials were analyzed from energy-absorption and stress wave spread.
应用推荐