用硅光刻工艺和二氧化硅湿法腐蚀工艺制作了针状封装结构的光纤消逝场传感器。
Evanescent wave fiber-optic sensors (EWFS) with acicular encapsulation were fabricated using silicon photolithography technology and silica wet-etching technology.
介绍了旋转载体用硅微机械陀螺敏感元件的结构和利用双面多次光刻、腐蚀等微机械工艺加工得到硅振动单元的工艺过程。
Using MEMS technics to process the silicon vibration element, in the process two side lithography and etching has being used many times.
同时还介绍了立体光刻技术结合抗腐蚀层、牺牲层工艺加工微器件的原理、方法和应用。
The method and the principle of manufacturing micro-machines by sacrificing layer technology together with 3-d lithography is discussed also.
其特点在于，利用KOH体硅腐蚀和双面光刻工艺制作了一种独特的三维自吸氧阴极结构。
The prototype features a unique 3D air-breathing cathode structure fabricated using KOH etching and double-side lithography.
其特点在于，利用KOH体硅腐蚀和双面光刻工艺制作了一种独特的三维自吸氧阴极结构。
The prototype features a unique 3D air-breathing cathode structure fabricated using KOH etching and double-side lithography.
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