Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
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