A wiring and interlayer dielectric layer may be formed over the first substrate including the readout circuit.
可在包括读出电路的第一衬底上方形成布线和层间介电层。
The invention provides a wiring board with through hole or non-through hole, and manufacturing method thereof. the wiring board comprises a substrate with hole in which metal wiring is formed;
这里提供一种具有通孔或非通孔的配线板及其制造方法。该配线 板包括具有孔的衬底。在孔中形成金属配线。
The method is as follows: the surface of a silicon substrate adopts the three-layer metal wiring of metal 1, metal 2 and metal 3;
所述方法是：在硅基板的表面采用金属1、金属2和金属3三层金属布线；
The method is as follows: the surface of a silicon substrate adopts the three-layer metal wiring of metal 1, metal 2 and metal 3;
所述方法是：在硅基板的表面采用金属1、金属2和金属3三层金属布线；
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