Wire bonding is a critical technique for realizing microwave hybrid circuit.
引线键合是实现微波混合电路的关键技术。
Statistical process control (SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
采用统计过程控制(SPC)技术，提高微电路产品的质量和可靠性，监控键合工序的生产过程状态。
The wire was bonded with directly bonding technique to the labial or lingual surfaces of teeth according to the application steps of light-cure material.
按光固材料的使用步骤，将弓丝粘到牙列片段的唇侧及舌侧。
The wire was bonded with directly bonding technique to the labial or lingual surfaces of teeth according to the application steps of light-cure material.
按光固材料的使用步骤，将弓丝粘到牙列片段的唇侧及舌侧。
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