• The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.

    器件失效主要表现温度试验管壳合点脱落引起失效原因与工艺过程键合所涉及材料有关。

    youdao

  • The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.

    器件失效主要表现温度试验管壳合点脱落引起失效原因与工艺过程键合所涉及材料有关。

    youdao

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