The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
This study is intended to evaluate the bondability and reliability of single crystal copper wire bonding.
本研究的目的是评估单晶铜引线接合的接合性和可靠性。
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