The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
A method of forming a chopped strand mat formed of bonding materials and wet use chopped strand glass fibers (WUCS) which demonstrate a reduced occurrence of static electricity is provided.
由粘结材料和湿法短切原丝玻璃纤维(WUCS)形成的短切原丝毡的形成方法，它显示出降低的静电出现机率。
This paper introduces a fabricated method of using fused silica as the chip material. It includes standard photolithography, wet chemical etching and bonding techniques.
本文介绍了选用优质石英为芯片基体材料的一种制作方法，关键技术包括标准的光刻，湿法腐蚀，键合等微加工技术。
The preparation method of alumina hollow fiber membrane by reaction bonding of aluminum oxide (RBAO) technique combined with dry wet spinning process was introduced in this paper.
介绍了铝氧化反应结合技术与干湿法纺丝工艺相结合制备氧化铝中空纤维膜的方法。
Good properties of strong bonding force, water resistance, heat and wet resistance, frozen and thaw. It can be constructed on the wet surface, no poison and no smell.
粘接力强，耐水、耐湿热、耐冻融性能优良，可在潮湿基层施工，无毒无味。
Good properties of strong bonding force, water resistance, heat and wet resistance, frozen and thaw. It can be constructed on the wet surface, no poison and no smell.
粘接力强，耐水、耐湿热、耐冻融性能优良，可在潮湿基层施工，无毒无味。
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