ESD is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems.
ESD 的问题不仅对于成品来说很重要，在制造过程中（从晶圆制程、封装到组装整个系统）也是很重要的课题。
In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number.
针对晶圆制造系统的多重入特性，提出了层周期、逻辑层数等概念。
Hundreds of systems are in use in wafer processing applications throughout the world.
成千上百种系统广泛应用于全球晶片工艺过程。
Hundreds of systems are in use in wafer processing applications throughout the world.
成千上百种系统广泛应用于全球晶片工艺过程。
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