This paper presents a new solution of minority carrier continuity equation for a wafer with different surface recombination velocity on its two surfaces.
本文给出了有相异表面复合速度时半导体薄片少子连续方程的一种新解法。
This paper presented one single chip micro inertial measurement unit based on ordinary bulk micromachining process such as dissolved wafer process.
论文基于普通的体硅工艺设计实现了一个单片集成式硅微惯性测量组合。
The paper presented a novel way to fabricate silicon microneedles with (110) si-wafer.
描述了一种用（110）晶面硅片制造微米针管的新方法。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
This paper studies a kind of new autocontrol system across-the-board, which can realize both the measurement of frequency and the separation of quartz crystal wafer.
本文主要研究了一种集晶片频率测量、分选于一体的新型石英晶片测量与分选的自动控制系统。
The difination, evolution, status and supporting technologies of wafer-level packaging are introduced and reviewed in this paper.
本文对圆片级封装的定义、演变、进展状况及支撑技术进行了介绍和分析评论。
In this paper, the principle of electron beam write wafer is discussed briefly distinguish topography mark, and make the technology of wafer mark which is found by the electron beam exposure system.
本文扼要介绍了电子束直写圆片的原理，地形标记的识别，以及电子束曝光系统能识别的圆片标记的制造技术。
This paper introduces the background of using Wafer Level Reliability technology, and expounds the characteristics and functions in details.
介绍了圆片级可靠性技术产生的背景，对其特点和作用作了详细的论述。
This paper discusses a true wafer level packaging (WLP) technology which is called Ultra CSPTM.
文章论述了超csptm圆片级封装技术工艺。
Using the photovoltaic spectral response of epitaxial P-N junction, the paper suggests a method of determining the minority carrier diffusion length in N layer of N/P epitaxial silicon wafer.
本文提出了用N/P硅外延片的结光电压光谱响应确定N/P硅外延片中少子扩散长度的方法。
Finally, this paper primarily establishes a testing method of characterization silicon carbide wafer quality.
最后，初步确立了表征碳化硅单晶抛光片质量的测试方法。
In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number.
针对晶圆制造系统的多重入特性，提出了层周期、逻辑层数等概念。
In this paper, the area contact model of depletion layer width under avalanche breakdown in Si epitaxial wafer by a three-probe method is analysed. The theory accords with experimental results.
本文分析了三探针测试硅外延片中雪崩击穿时耗尽层宽度的面接触模型，理论和实验结果吻合。
This paper introduces that we can reduce Within wafer nonuniformity (WIWNU) to achieve part and full planarization by distributing the speed of polishing head and polis.
介绍了在化学机械抛光过程中，可以通过抛光头与抛光台运动速度关系优化配置，降低晶片表面不均匀度，从而更好地实现晶片局部和全局平坦化。
The machine is widely applied to transparent film 3D automatic packages in bulk poker, sachima, newspaper stick, scribbling paper, wafer biscuit and other related bulk things.
该机主要适用于散装扑克、压缩饼干，沙琪玛、报事贴、便笺纸、威化饼干等散状或多件物体集合的三维包装。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. Reactions and bonding between glasses in an electric field were discussed in this paper.
静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
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