The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
The invention relates to a radiator fan, which comprises a fan frame, an inner rotor motor, at least an impeller and a circuit wafer.
一种散热风扇，其包含一个扇框、一个内转子马达、至少一个叶轮及一个电路板。
The invention relates to a radiator fan, which comprises a fan frame, an inner rotor motor, at least an impeller and a circuit wafer.
一种散热风扇，其包含一个扇框、一个内转子马达、至少一个叶轮及一个电路板。
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