After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
A wafer with poor surface quality has hidden risks of stress concentration and little cracks, which would cause a huge damage of bursting crack when dicing the wafer.
表面质量不好的晶圆会存在应力集中、裂缝等隐患，在分割晶圆片时，会导致晶圆崩裂的巨大损失。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
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