Direct wafer makes individual wafers straight from molten silicon-no cutting required.
直接硅片技术能直接在熔融晶中制成单片晶圆，不需要切割。
Cutting groove grids on wafer surface in a special size and shape depends upon the costumers needs.
按客户要求的规格和形状在硅片表面切割出具有一定深度的沟槽。
To introduce a number of polysilicon, wafer supporting projects, such as high purity quartz powder projects, cutting fluid, silicon carbide, cutting line, band saw into the zone.
硅料、硅片生产重要配套项目：如高纯度石英粉产业化项目、切割液、碳化硅、切割线、带锯等。
The relationship between grinding marks and the grinding parameters is analyzed. The cutting trajectories of grits on the wafer are predicted by computer simulation.
本文建立了硅片自旋转磨削的运动几何学模型，分析了磨削参数与磨削纹理的关系，并对磨粒磨削运动轨迹进行了计算机仿真和预测；
Wafer Conveyor: delivering the wafer which has passed through the cream spreading, layup and lamination procedures to the cutting machine.
输送饼片机：将奶油涂层机叠压好之饼片送至介切机。
YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.
YMS - 50激光切割机是专用于太阳能硅片电池切割的设备。
YMS-50 Laser cutting machine special used in cutting for solar cell and semiconductor silicon wafer.
YMS - 50激光切割机是专用于太阳能硅片电池切割的设备。
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