The goal of LCTI-M is to develop a wafer scale manufacturing process that will make thermal imagers affordable and accessible to every warfighter.
LCTI - M的目标是开发一种晶圆级制造流程，这将使热成像仪普及应用到美军每一名士兵。
Scale and an uncanny ability to predict commodity-price movements has allowed Glencore to make decent returns in a business where margins are wafer-thin.
它的规模和能预知商品价格运动这样惊人的能力让嘉能可从利润微薄的业务中获得不错的回报。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly.
帕洛马技术3500III执行全自动晶圆级封装和先进的微电子组装。
To introduce a number projects on the scale of the wafer, solar cells, module, thin-film batteries and photovoltaic end-use applications products into the zone.
一是引进一批上规模的晶硅片、太阳能电池、组件、薄膜电池及终端应用产品等光伏主业项目。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。
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