• The material of the vacuum sputtering layer is lead or lead alloy.

    真空溅射层的材质为铅或铅合金。

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  • The technology and equipment of the vacuum sputtering coating have the extremely broad application and the development in the future.

    真空溅射镀膜技术及设备在当今和未来都拥有十分广阔的应用领域和发展前景。

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  • There are integrated equipments on vacuum sputtering plating which can provide surface fabrication such as UV, NCVM, EMI, induration.

    真空(溅)镀膜有完整的加工设备,可提供UV、不导电NCVM、EMI、硬化…等表面加工处理。

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  • Compared with the pollution of the traditional plating or spray coating method to the environment, the vacuum sputtering is environmental process and accords with ROHS standard completely.

    相对于传统水电镀或喷涂方式对环境的污染,真空溅射是环保制程,完全符合ROHS标准。

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  • The electronic circuitry of the various vacuum protection schemes, which use sputtering ion pump or cold-cathode or hot cathode ionization gauge as sensors, was compared.

    分析比较了溅射离子泵、冷阴极电离超高真空计、热阴极电离超高真空计等作为真空保护传感器的不同电子学设计。

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  • The techniques of depositing zinc thin film on grass substrate by vacuum evaporation and direct-current sputtering were investigated with XRD, SEM and AFM in this paper.

    本论文对真空蒸发法和直流溅射法沉积锌膜的工艺进行了研究,结合XRD、SEM、AFM等分析手段,以探索这两种方法在制备锌膜方面的一般规律。

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  • A series of giant positive magnetoresistance of magnetic multilayer structure were fabricated by ion-beam sputtering in high vacuum with applied magnetic field and treatment.

    采用离子束溅射方法制备了正巨磁电阻多层膜,在制备过程中采用外加磁场和退火处理。

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  • The enterprise deyang sunlight electric co. , ltd. has special knowledge within the ranges roasting, thyristor and vacuum coating as well as sputtering.

    公司专业从事晶闸管可控硅整流器、烤架以及真空镀膜和溅射业务。

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  • The ion plating is a new technique combined vacuum evaporation plating with sputtering.

    离子镀是真空蒸镀与溅射相结合的新工艺。

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  • The heating equipment of vacuum sputter coating apparatus always sparks during sputtering, Using metal-screening and surface earth can solve this problem well.

    真空溅射镀膜设备中加热装置在镀膜时常出现打火现象,本文采用金属屏蔽和外壳接地的方法很好地解决了这一问题。

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  • Various Pd films prepared on glass substrates by magnetron sputtering in vacuum or O2 ambience were used as catalysts.

    结果表明,在真空气氛下磁控溅射的钯膜上无法生长碳纳米管。

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  • The thin film can be prepared by a plurality of film plating techniques such as high vacuum thermal evaporation, electron beam deposition and sputtering.

    该薄膜可采用高真空热蒸发、电子束沉积以及溅射等多种镀膜技术制备。

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  • The method can be used not only for vacuum evaporation deposition, but also for sputtering deposition to prepare the thin-film.

    它既能用于真空蒸发沉积,又可用于溅射沉积来制备薄膜。

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  • Many processes are used to prepare transparent conductive films, such as magnetron sputtering, vacuum reactive evaporation, chemical vapor depositions, Sol-gel, laser-pulsed deposition.

    多种工艺可以用来制备透明导电薄膜,如磁控溅射真空反应蒸发、化学气相沉积、溶胶-凝胶法以及脉冲激光沉积等。

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  • It is a sophisticated process, performed under vacuum which deposits microscopic particles on the products by ion bombing or sputtering, to form a protecting coating on their surface.

    这是一个复杂的过程,在充满微粒子的真空环境下对产品进行离子溅镀,以在产品表面形成保护层。

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  • Based on the low evaporation temperature of organic semiconductors, a radioactive heater-crucible assembly was developed for vacuum evaporation coating and sputtering coating systems.

    针对有机半导体材料的蒸发温度低的特点,设计并制作了低温辐射式加热器。

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  • Using high vacuum magnetron sputtering system, it is coated sensitive film on the optical fiber end face, silicon, glass.

    并采用高真空磁控溅射镀膜技术将敏感膜溅射在光纤端面、硅片、有机玻璃上。

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  • Uses: sputtering target, physical vapor deposition, high temperature alloy for high-voltage vacuum switch contacts and precision alloy additives.

    用途:溅射靶材、物理气相沉积、高温合金、用于高压真空开关触头及精密合金添加剂。

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  • The invention relates to a device for improving utilization rate of a high vacuum ion beam sputtering target material.

    本发明涉及一种高真空离子束溅镀靶材利用率增强装置。

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  • Special importance were attached to the design and calculation of deposition chamber, vacuum system, sample system, sputtering cathode and control system.

    作为重点,对真空室、真空系统、工件架、磁控溅射靶、控制系统等进行了相应的设计分析和计算。

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  • Special importance were attached to the design and calculation of deposition chamber, vacuum system, sample system, sputtering cathode and control system.

    作为重点,对真空室、真空系统、工件架、磁控溅射靶、控制系统等进行了相应的设计分析和计算。

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