Because the hardness of substrate was low after vacuum melting, the hardness of substrate was increased by hardening and tempering methods.
由于真空烧结涂层基体的硬度较低，采用对基体调质处理的方法来提高涂层基体的硬度。
Because the hardness of substrate was low after vacuum melting, the hardness of substrate was increased by hardening and tempering methods.
由于真空烧结涂层基体的硬度较低，采用对基体调质处理的方法来提高涂层基体的硬度。
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