The method to improve tin sulfate solution deep-electroplate, solution safeguard and notice in manufacture etc. are narrated.
叙述了提高硫酸亚锡溶液深镀能力的办法，溶液的维护和在生产中应注意的问题。
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed.
为进一步提高镀锡层的性能，研制出一种多功能硫酸盐镀锡添加剂。
The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.
研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。
The effect of nickelous sulfate and hydrazine on thickness and appearance of electroless tin coatings were studies by electrochemical methods.
采用电化学等方法研究了硫酸镍和水合肼对化学镀锡层厚度及表面形貌的影响。
The effect of nickelous sulfate and hydrazine on thickness and appearance of electroless tin coatings were studies by electrochemical methods.
采用电化学等方法研究了硫酸镍和水合肼对化学镀锡层厚度及表面形貌的影响。
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