Tin plating as early as 1843 puts forward the first patent, and after 1930 have industrial practical.
电镀锡早在1843年就提出了第一个专利，1930年之后才具备工业实用性。
For example steel base plated copper, nickel, chromium plating, low layer again tin bronze chrome, multi-layer nickel chrome plating nickel ferroalloy, chrome, and so on.
例如钢基上镀铜、镍层再镀铬、低锡青铜上镀铬、多层镍上镀铬、镍铁合金镀层上镀铬等等。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
Black tin coating was prepared by multi-arc ion plating technology and wear resistance corrosion resistance heat-proof property and absorption property of solar spectrum were also discussed.
摘要介绍了利用多弧离子镀工艺制备黑色氮钛膜，并对其耐磨损、耐腐蚀、热稳定性及太阳光谱吸收等性能进行了研究。
Author made selection and experiment for brighteners and stabilizers which are used for acidic bright tin plating. More ideal brightener and stabilizer are obtained through the experiments.
作者对酸性光亮镀锡的光亮剂及稳定剂进行了选择，并作了试验，获得了较为理想的光亮剂和稳定剂。
Before or tin plating nickel plating of bad contacts between the cathode, discharge sparks will melt into hollow copper hole.
镀镍前或锡电镀间的阴极接触不良，放电火花将铜材熔成凹洞。
Causes for the hydrogen embrittlement during alkaline tin plating of elastic articles were discussed, preventive and remedial measures were presented.
探讨了弹性零件碱性镀锡产生氢脆的原因并提出了预防及消除措施。
Zinc coating was prepared using mechanical plating technology for the deposition of small amount tin salt.
采用少锡盐沉积机械镀锌工艺制备了机械镀锌的镀层。
A new immersion plating process was developed in which copper sulfate and stannous sulfate were used as main salt, with addition of complex, brightener and stabilizer to tin salt.
采用硫酸铜、硫酸亚锡为主盐，加入络合剂、光亮剂、锡盐稳定剂，研究成功了一种新的浸镀铜锡合金工艺。
In order to further improve the properties of tin electrodeposits, a multifunctional sulfate tin plating additive was developed.
为进一步提高镀锡层的性能，研制出一种多功能硫酸盐镀锡添加剂。
Black tin coating was prepared by multi arc ion plating technology, and wear resistance, corrosion resistance, heat proof property and absorption property of solar spectrum were also discussed.
介绍了利用多弧离子镀工艺制备黑色氮钛膜，并对其耐磨损、耐腐蚀、热稳定性及太阳光谱吸收等性能进行了研究。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
The effect of bismuth sulfate content in plating bath and current density on current efficiency, bismuth content and morphology of obtained tin-bismuth alloy was studied.
研究了镀液中硫酸铋含量和电流密度对镀层铋含量、电流效率及镀层表面形貌的影响。
A cyanide tin - copper plating process was optimized by means of orthogonal test. The effect of bath components of electrolytic solutions and electrodeposits was investigated.
采用正交试验研究了氰化镀铜锡合金工艺中各因素水平与镀液、镀层性能的关系，优选出一种最佳工艺配方。
The process formula and flow of BH-411 bright sulfate tin plating, maintenance and management of the bath were introduced.
介绍了BH-411光亮硫酸镀锡的工艺配方、工艺流程和镀液的维护与管理，讨论了镀液中的硫酸、硫酸亚锡和添加剂的作用。
The process of electroless tin plating has wide applications in microelectronic filed.
化学镀锡工艺在微电子行业具有很好的应用前景。
PLATIVE ISP3023, a kind of insulated protective paint, is specialized applied to general plating treatment, or acid pickling, such as nickel plating, copper plating, chrome plating, tin plating, etc.
PLATIVE ISP3023是一种耐酸蚀绝缘保护油墨，专门开发应用于电镀一般金属的阻镀保护作用，或者酸蚀加工抗蚀保护作用，如镀镍、镀铜、镀铬、镀锡等；
Sulfate tin plating process has been widely used in electroplating industry for its strengths such as high current efficiency, fast plating rate, low cost and easy effluent disposal.
硫酸盐光亮镀锡工艺具有电流效率高、沉积速度快、成本低及废水易处理等优点，在电镀生产中已广泛应用。
A new technology of tin-nickel alloy electroplating from a pyrophosphating bath was studied. The effect of some plating parameters on the tin-nickel alloy coating was discussed.
研究了从焦磷酸盐槽液中电镀锡镍合金的一种新工艺，讨论了一些电镀参数对锡镍合金镀层的影响。
Operating hints and safety requirement of re melting in crystal pattern tin plating were introduced.
介绍了晶纹镀锡中重熔工序的操作要点和安全要求。
The mechanism of electroless tin plating was discussed.
对化学镀锡的机理做了探讨。
The processes of application research of rare earth elements as additives on zinc, chromium, nickel, tin, iron, copper plating were described.
简述了稀土添加剂在国内镀锌、铬、镍、锡、铁、铜工艺上的应用研究进展。
The invention relates to a piston ring and a surface spongy tin plating technique thereof.
一种活塞环及其表面松孔镀锡工艺。
The effects of the composition and controlled conditions of electroless tin plating on the morphology of coatings are investigated.
研究了化学镀锡溶液组成和工艺条件对镀层表面形貌的影响。
Five, tin gun black, tin cobalt nickel alloy plating gun black, cupronickel tin and chromium, cyanogens plating cupronickel tin environmental roll.
锡镍枪黑色、锡钴合金镀枪黑色、白铜锡代铬、无氰环保滚挂镀白铜锡。
We have over 10 machines for steel ball manufacturing and filtering. And, one plating line is ready and it can plate nickel and tin.
本公司有生产和分选导电钢珠珠的专业设备十几台，并且建有一条专门的电镀生产线，为本公司的产品电镀锡和镍。
Main products are as follows: a circuit board, gilded burnish, gold plated copper thick OSP protection (series), PCB plating copper brightener, PCB tin brightener, etc.
主要产品如下：一、线路镀金光泽剂、线路板镀厚金工艺、线路板铜保护(osp)系列、线路板镀酸铜光亮剂、线路板镀锡光亮剂等。
Besides, deposition rate of electroless tin also increases with increasing plating time.
若继续升高镀液温度，沉积速率却降低。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced.
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
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