The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements.
第三基底层有用以与第一和第二多个阵列元件交换一个或多个射频(RF)信号的集成电路。
The third substrate layer has an integrated circuit to exchange one or more radio frequency (RF) signals with the first and second pluralities of array elements.
第三基底层有用以与第一和第二多个阵列元件交换一个或多个射频(RF)信号的集成电路。
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