A unique oxide thinning process is proposed in order to investigate the effect of oxide thickness on soldering properties.
为研究不同氧化层厚度对焊料性能的影响，开发出一种新的焊料表面氧化层减薄工艺。
The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.
焊料表面氧化层厚度的减小能够降低焊接过程中焊料粉末的结合阻力，助焊剂更容易将氧化物清除，有助于焊料合金的融合。
The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.
焊料表面氧化层厚度的减小能够降低焊接过程中焊料粉末的结合阻力，助焊剂更容易将氧化物清除，有助于焊料合金的融合。
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